How to select the right substrates for your power modules

Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) ceramic substrates are the most popular substrates for the assembly and packaging of IGBT and MOSFET bare dies in power modules. As a designer of power modules, you will have to select the right substrate for your application. In this webinar, you will learn how the ceramic grade, the ceramic thickness and copper thickness are influencing the isolation voltage, output power and reliability of your module. In only 3 steps, you will be able to find the best trade-off between the main characteristics of DBC / AMB substrates to fulfill the requirements of your application.




  • Olivier Mathieu holds a master degree in material science from Institut National des Sciences Appliquées Rennes, France. Olivier has been with Rogers Corporation since 2006, working first as an application engineer to provide worldwide technical support for metallized ceramic substrates and micro channel coolers. Later he has taken over the head of technical marketing before being appointed product innovation manager for curamik product within Rogers’ PES division.

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October 2018

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